By the trend of nano- and micro scale and the associated arrangement of components on smaller and smaller spaces, the development and the influence of temperatures in microelectronics increases. The temperature distribution influences various factors in construction and design. The components have to be arranged in a way that the heat does not accumulate at specific points or exess heat can be transported easily and thus the functionality is not affected. Consequently, this results in the issue of  the dimensioning and simulation of cooling on the board.

Figures 1 & 2 show exemplary the temperature and flow profile of three exothermic components under the influence of a linear, turbulent air cooling. In Fig. 1 we can see that the amount of heat emitted by the component can be completely absorbed and dissipated by convection. Tendentially the temperature increases with the distance from the cooling source. Figure 2 shows the flow profile, which is due to the available space in the cooling supply system. In addition, turbulence can be seen behind the components. This can be utilized to cool certain areas directly.  For larger components, which produce more heat, a place with good cooling conditions is needed.  This could be a place with a higher air flow or a place close to the cooling system in order to regulate the amount of produced heat. In general, semiconductor devices integrated circuits are sensitive to heat. The operating temperature range for commercial use is between 0 ° C and 70 ° C. Passive components usually based on this temperature area. Besides, there are special electrical resistors components, which can  operate at the temperatures above 125 ° C. Under these aspects geometries for integrated circuits can be constructed and optimized to optimally use the packaging of the components and the cooling flow.